Shipping high-value, sensitive items like printed circuit boards requires packaging with a higher level of engineering and manufacturing expertise. Our client pushed these requirements to the max when they approached us to develop a second generation package for their PCBs.
As with most of electronic component trays we manufacture, we needed to ensure that all trays were made using an ESD conductive material. However, it was the client's desire to achieve levels of detail usually only achievable with injection molding processes with our lower-cost precision thermoforming that really pushed our team, technology and equipment to its limits.
Thanks to our highly sophisticated thermoforming machines, our team was able to create tooling and processes that could hit the deep draw ratios needed to create the support brackets. Plus, great care was taken to achieve a high level of detail on the surface so part numbers and date stamps were clear.
The end product consisted of a precision molded tray capable of securing the PCBs on end - allowing the tray to safely store significantly more cards than with the first generation tray. After outfitting with a clear lid, the complete package increased shipping capacity while reducing damage and improving overall performance.